Polyimide Tape


Upon Completion ot PCB insertion routine during SMT process, The polyimide tape is applied to shield the remaining holes on PCB and to prevent solder from wicking under components and contamination during flat soldering process. The polyimide Tape are approved by UL.


High Temperature Retention
Flame retardant
Ul recognized

Application :

• For use in High performance electrical application on high temperature coil, Such as in traction machine manufacturing, under products of generators, capacitors, transformers etc.


• For masking off gold contacts on PCB board during wave soldering process and during hot air levelling or for splicing other high temperature insulation materials.