Application:
(Golden Finger Protection series) Designed to fully protect gold or rhodium plated P.C.B. finger contacts through the flux and high heat of molten solder during solder coating and hot air leveling.
(PCB Protection series) Designed for masking PCB to resist plating bath chemical during tin/lead strip¬ ping and precious metal (such as gold or rhodium) plating of finger contacts.
.
Technical Data:
| S. No |
Backing |
Adhesive |
Total
Thickness |
Tensile
Strength
(kg/25mm) |
Elongation |
Resistance |
| 1 |
Flat Back Paper
+
PET |
Silicone Base |
0.29±0.03 |
25 T |
5? |
250x1 min. |
| 2 |
Creped Back Paper
+
PET |
Silicone Base |
0.26±0.03 |
15? |
10[ |
250*1 min. |
| S. No |
Backing |
Adhesive |
Total
(mm) |
lesion io
(kg/25m) |
Heat
Resistance
(CC) |
Dielectric
breakdown
(kv) |
| 1 |
PET Film |
Silicone Base |
0.075±10% |
0.81 |
200*2hr |
5T |
| 2 |
PET Film |
Silicone Base |
0.10±0.005 |
0.8| |
200*2hr |
5T |
|
